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SPECIFICATIONS
Essentials
Status
Launched
Launch Date
Q309
Processor Number
i7-870
# of Cores
4
# of Threads
8
Clock Speed
2.93 GHz
Max Turbo Frequency
3.6 GHz
Intel® Smart Cache
8 MB
Bus/Core Ratio
22
DMI
2.5 GT/s
Instruction Set
64-bit
Instruction Set Extensions
SSE4.2
Embedded Options Available
No
Lithography
45 nm
Max TDP
95 W
VID Voltage Range
0.6500V-1.4000V
Memory Specifications
Max Memory Size
(dependent on memory type)
16 GB
Memory Types
DDR3-1066/1333
# of Memory Channels
2
Max Memory Bandwidth
21 GB/s
Physical Address Extensions
36-bit
ECC Memory Supported
No
Graphics Specifications
Integrated Graphics
No
Expansion Options
PCI Express Revision
2.0
PCI Express Configurations
1x16, 2x8
# of PCI Express Ports
1
Package Specifications
Max CPU Configuration
1
TCASE
72.7°C
Package Size
37.5mm x 37.5mm
Processing Die Size
296 mm2
# of Processing Die Transistors
774 million
Sockets Supported
LGA1156
Halogen Free Options Available
Yes
Advanced Technologies
Intel® Turbo Boost Technology
Yes
Intel® vPro Technology
Yes
Intel® Hyper-Threading Technology
Yes
Intel® Virtualization Technology (VT-x)
Yes
Intel® Virtualization Technology for Directed I/O (VT-d)
Yes
Intel® Trusted Execution Technology
Yes
AES New Instructions
No
Intel® 64
Yes
Idle States
Yes
Enhanced Intel SpeedStep® Technology
Yes
Intel® Demand Based Switching
No
Thermal Monitoring Technologies
No
Execute Disable Bit
Yes |
